Activities

The Clean Room, using air conditioning and air filters, provides a working environment where dust concentration and thermal and hygrometric conditions are controlled. In this laboratory it will be possible to use advanced techniques of micro and nanomanufacturing to produce Micro Electric Mechanical Systems (MEMS), micro electrodes and scaffolds with dimensions comparable to cells, innovative devices for different applications.

The following will be available:

• lithographic techniques such as photolithography, electronic beam lithography, LASER writing and soft-lithography.
• various techniques for the deposition of materials: Chemical deposition from steam phase of dielectric materials (PECVD), physical deposition from steam phase of metals and dielectric materials (electronic beam evaporator and thermal evaporator), deposition of polymers via spin-coating, electrochemical deposition of metals.
• techniques for material etching: 'wet etching' in chemical hoods and 'dry etching' by gas Plasmas (ICP-RIE, RIE and oxygen plasma);
• "Critical Point Dryer" for suspended micro- structures;
• "Wafer Bonder" for wafer to wafer bonding processes;
• packaging techniques such as  chip cutting ("Wafer Dicer") and bonding of electric micro-wires ("Wire Bonder");
• Metrologic techniques such as profilometry, optical microscopy and microscopes based on probe scanning ("AFM").